- hBN : excellent thermally conductive with electrically insulating
- high loading of hBN within resin is difficult due to its surface incompatibility
- surface treatment make it possible high loading hBN within silicone, epoxy matrix
: reduced viscosity make high loading of hBN to improve thermal conductivity
- Silicone resin (Sylgard 184A) 5,000 Cp
- Epoxy resin (YD 128) 13,550 Cp
Particle Size (D50) | TD (g/cc) | BET (m2/g) | |
BN05-C | 5 um | 0.4 | 7 |
BN10-C | 10 um | 0.5 | 5 |
BN20-C | 20 um | 0.6 | 3 |
BN30-C | 30 um | 0.6 | 2 |