PRODUCT HIGHLIGHTS:
High Temperature Resistance: Capable of withstanding short-term temperatures up to 280°C (536°F) and continuous temperatures of 250°C (482°F).
No Residue Technology: Features a premium silicone adhesive that peels off cleanly without leaving any sticky residue on gold fingers or delicate electronics.
Superior Insulation: High dielectric strength and chemical resistance make it the ideal choice for protecting sensitive PCB components during wave soldering and BGA processes.
Multi-Purpose Utility: Essential for 3D printing heat beds, vacuum bagging, powder coating, electrical motor insulation, and heat press sublimation for mugs or plates.
Durable & Flexible: Excellent tensile strength and tear resistance, maintaining stability even under extreme heat and chemical exposure.
TECHNICAL SPECIFICATIONS:
Material: Polyimide (PI) Polymer
Adhesive Type: High-Performance Silicone
Color: Transparent Amber / Metallic Gold
Standard Thickness: 0.05mm
Temperature Range: -73°C to 280°C (-100°F to 536°F)
Tensile Strength: >= 115N / 25mm
Elongation at Break: >= 50%
Dielectric Strength: 5,000 Volts
Standard Length: 33 Meters (108 Feet)
APPLICATIONS:
Electronics: Masking gold fingers during wave soldering or SMT reflow.
3D Printing: Protecting the heating bed surface or wrapping heater blocks.
Automotive: Protecting sensors, coils, and manifolds in high-heat environments.
DIY Crafts: Securing transfer paper during sublimation on ceramics or fabrics.