Samsung mass-produces UFS 3.1 for ultra-low power vehicles

Samsung Electronics started mass production of UFS 3.1 memory solution for in-vehicle infotainment (IVI) with the lowest power consumption in the industry.

UFS 3.1 (Universal Flash Storage 3.1) refers to next-generation ultra-high-speed flash memory to which the 'UFS interface', the internal memory standard of the international semiconductor standardization organization 'JEDEC', is applied. This product has improved power consumption by about 33% compared to the previous generation products based on the 256GB lineup. It is expected that it will be an optimal solution for electric vehicles and self-driving vehicles as it can increase the efficiency of vehicle battery power operation with improved power consumption. It supplies to manufacturers and auto parts makers, and is set out to expand the automotive semiconductor market, which is one of the future growth engines. It is expected to meet the diverse needs of customers by supplying up to 512GB products scheduled for production in the fourth quarter. Based on a 256GB product, it provides a continuous reading speed of 2000MB/s and a continuous writing speed of 700MB/s.
* Continuous reading speed: The speed of retrieving data already stored in the storage memory (MB/s)< /span>
* Continuous write speed: The speed at which data can be saved to the storage memory (MB/s)

In addition, this product is the AEC quality standard for automotive semiconductors. - Satisfies Q100 Grade 2. It guarantees stable performance in a wide temperature range from -40℃ to 105℃. AEC-Q100 (Automotive Electronic Council) defines the reliability evaluation procedure and criteria for automotive electronic parts by the Automotive Parts Association, which means standards commonly used around the world. Auto Grade is divided into 0 to 3 stages depending on the temperature standard. It is a product that meets the memory trend,” he said. “It is of great significance that we provided a solution specialized for IVI at the right time.” It plans to actively target the automotive semiconductor market along with the UFS 3.1 product for advanced driver assistance systems (hereinafter referred to as ADAS, Advanced Driver Assistance System), which was released in 2022, while expanding the applications of the product family.