hBN (micro/nano, hydrophilic/hydrophobic surface modification)
Insulating heat dissipation filler with enhanced thermal conductivity
Seller Name
Micro-Composite, Inc Phone number
+82-504-1361-0450 
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Product Overview
Product Name
hBN (micro/nano, hydrophilic/hydrophobic surface modification)
Country of manufacture
Republic of Korea
Manufacturing company
Micro-Composite, Inc
Product Description
uFeatures
- hBN : excellent thermally conductive with electrically insulating
- high loading of hBN within resin is difficult due to its surface incompatibility
- surface treatment make it possible high loading hBN within silicone, epoxy matrix
: reduced viscosity make high loading of hBN to improve thermal conductivity
u Characteristics of Surface Treatment : Improved Dispersion/Fluidity
• Test condition (Brookfield, 25℃, ASTM D4287)
- Silicone resin (Sylgard 184A) 5,000 Cp
- Epoxy resin (YD 128) 13,550 Cp
• Surface treatment of specific functional group by customer request is possible
uhBN Powder (Other size is Available)
Model : BNx-y (x : D50 particle size, y : functional group)
uhBN Powder (Other size is Available)
| Particle Size (D50) | TD (g/cc) | BET (m2/g) | |
| BN05-C | 5 um | 0.4 | 7 |
| BN10-C | 10 um | 0.5 | 5 |
| BN20-C | 20 um | 0.6 | 3 |
| BN30-C | 30 um | 0.6 | 2 |
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